Semiconductor AOI Inspection Platforms

Metrology-Grade Accuracy

through industry-leading Multi-Reflection Suppression® (MRS®) sensor technology delivers highly accurate data, precisely identifying and suppressing reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is essential for high-precision measurement, making MRS an ideal technology for a wide range of applications, including those with the most demanding quality requirements. 

High-speed inspection + High-resolution inspection

uses MRS® sensors to capture multiple images simultaneously and transmit them in parallel, while highly sophisticated fusion algorithms merge the images together, delivering microscope-grade image quality at production speed. The innovative dual-mode MRS sensor in the SE3000™ SPI system provides great flexibility for solder-paste inspection: one mode for high-speed inspection and the other for high-resolution inspection.     

Fast, smart, easy-to-use software 

The software is powerful yet simple to operate; the intuitive multi-touch interface and 3D visualization tools reduce training effort, minimize operator burden, and save time and cost.

Reduces rework cost, increases yield, and improves quality based on feedback — an SPI system with closed-loop feedback co-developed with leading printer and SMT mounter manufacturers.

CyberPrint Optimizer™ predictive process-improvement capability automatically optimizes the printing process by proactively analyzing current trend data, improving yield and reducing downtime.

Machine- and factory-level SPC capabilities help improve yield.