Multi-Function SQ7000+ for 3D AOI, SPI and CMM
SQ7000+ The multi-function system uses Multi-Reflection Suppression® (MRS®) sensor technology with high resolution, high accuracy and high-speed inspection and metrology — the only system on the market that performs AOI, SPI and CMM inline.
Precision Grade
Normal Grade N
High Grade H
Precision Grade P
Super Precision SP
Ultra Precision UP
| Inspection Speed | 16 cm²/sec (2D+3D) |
| PCB Size | Min: 50 x 50 mm (2 x 2 in.); Max: 420 x 320 mm (16.5 x 12.5 in.) |
| Resolution XY / Z | 5 µm / 0.1 µm |
| Max Weight (PCB or sample) | 10 kg |
| Component Types Inspected | Standard SMT (chips, J-leads, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, pin-headers etc. |
| Solder joints and other defects | Gold-finger contamination, excess solder, insufficient solder, bridging, through-hole pins |
| Minimum Component Size | 0201 mm (008004 in.) |
| Allowable Product Height | Top: 20 mm; bottom: 50 mm |
| Field of View (FOV) | 25 x 25 mm |
| Min/Max measured height: | Min 10 um; max 400 um (spec), 2.4 mm (performance) |
| Component Defects | Missing, polarity, tombstoning, skewing, flipping, wrong parts, oversized, damaged leads, etc. |
| Coordinate Measurement Capability | Linear / distance / X,Y / midlines, intersection points / best-fit shifts, datum X,Y / LSF X,Y offset, X,Y Offset / value / position / X,Y value lists, height / local height / best-fit / radius, coplanarity / distance-to-plane / second-order fit, deviation / absolute / √2 / Cpk, max / min / average / sigma / add / subtract / multiply |